Bringing signals into phase

How we use and generate electricity has changed dramatically over the past century yet the basic components that control its flow remain remarkably similar. Researchers at KAUST have now developed a novel type of component ...

Printing silicon on paper, with lasers

In seeking to develop the next generation of micro-electronic transistors, researchers have long sought to find the next best thing to replace silicon. To this end, a wealth of recent research into fully flexible electronic ...

Semiconductor miniaturisation with 2D nanolattices

A European research project has made an important step towards the further miniaturisation of nanoelectronics, using a highly-promising new material called silicene. Its goal: to make devices of the future vastly more powerful ...

Researchers test radiation-resistant spintronic material

A team of researchers from the University of Michigan and Western Michigan University is exploring new materials that could yield higher computational speeds and lower power consumption, even in harsh environments.

Bubbles are the new lenses for nanoscale light beams

Bending light beams to your whim sounds like a job for a wizard or an a complex array of bulky mirrors, lenses and prisms, but a few tiny liquid bubbles may be all that is necessary to open the doors for next-generation, ...

The next network

Microcontrollers are everywhere. Essentially tiny computers that are embedded in machines, they supervise a rapidly-expanding universe of functions. In washing machines, for instance, they may access information embedded ...

Researchers build switchable magnetic logic gate

(Phys.org)—A team of scientists from several research centers in South Korea, has succeeded in building a logic circuit that is based on switchable magnetism, rather than electronics. They describe their research and a ...

Electronics that flex and stretch like skin

Imec announced today that it has integrated an ultra-thin, flexible chip with bendable and stretchable interconnects into a package that adapts dynamically to curving and bending surfaces. The resulting circuitry can be embedded ...

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